Today, global memory leader Team Group Inc. announced today the launch of three AIO CPU liquid coolers - the T-FORCE SIREN DP360 ARGB, GA360M ARGB, and GA240M ARGB AIO CPU Liquid Coolers. With a revolutionary magnetic design on the water block, users can effortlessly attach either an LCD or ARGB module, complemented by a pre-installed fan lock on the radiator for added convenience. Compatible with the latest Intel LGA 1200/1700 sockets and AMD AM4 and AM5 platforms, the coolers empower users to harness the full potential of dual-platform processors. Combining powerful performance with striking aesthetics, these coolers redefine heat dissipation standards.

The T-FORCE SIREN DP360 ARGB utilizes Asetek's 8th module, featuring a six-wire, three-phase motor for exceptional liquid cooling performance. Its 30 mm thick aluminium radiator, combined with a pre-installed high-pressure ARGB PWM fan, significantly enhances cooling efficiency with the increased surface area. The DP360 ARGB offers fast and convenient installation, with two options available: with or without a magnetic LCD Display module on the water block. With the specially developed T-FORCE software, users can unleash their creativity, customizing high-resolution images up to 480 x 480 and displaying vibrant visuals with 16.8 million colors. Showcasing personalized GIF animations and real-time hardware monitoring to guarantee an elevated gaming experience.

GIGABYTE Technology, Giga Computing, a subsidiary of GIGABYTE and an industry leader in AI servers, server motherboards, and workstations, today announced its support of AMD EPYC 4004 Series processors on AM5 socket servers and server motherboards for entry-level enterprise customers. This will require a BIOS update, which will come pre-installed in the near future.

The new AMD EPYC 4004 platform, built on the AM5 socket, delivers enterprise-grade features that allow small businesses and cloud services to have dependable daily operations with minimal downtime. For reliability and manageability, the platform has been validated for compatibility with server operating systems: Ubuntu, RHEL, and Windows Server. By doing so IT administrators can better control and monitor systems, as well as protect businesses against cyberthreats.

Today, TYAN, a leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, introduced its latest offering: affordable and high-performance servers and motherboards powered by the new AMD EPYC 4004 Series CPUs. "The new AMD EPYC 4004 Series CPUs, along with our strong ecosystem of technology partners, bring enterprise solutions to a traditionally underserved market and ensure that small and medium businesses have access to highly-performant technologies that help them stay competitive," said John Morris, corporate vice president, Enterprise and HPC Business Group, AMD. "The AMD EPYC 4004 CPUs fill an important market gap, providing cost-optimized solutions with enterprise-grade dependability, scalability and security in cost-optimized system configurations that make sense for smaller businesses and dedicated hosters."

AMD EPYC 4004 Series processors complement the broad AMD EPYC processor offering, extending the established high performance, highly efficient "Zen4" core architecture into an expanded range of entry level system designs desired by small business customers as well as regional hosted IT services providers. With new low core count CPU offerings and TDP ranges as low as 65 W, attractively priced server systems featuring AMD EPYC 4004 Processors deliver the strong performance, scalability and dependability needed by growing businesses and 24x7 hosted services. With an optimized, single-socket package, 2 channels of DDR5 memory and up to 28 lanes of Gen 5 PCIe connectivity, these servers offer a compelling balance of performance and scalability in an affordable, easy-to-deploy, easy-to-manage package.

Supermicro, Inc., a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, is announcing additions to the AMD based H13 generation of CPU Servers, optimized to deliver an outstanding balance of performance and efficiency and powered by the AMD EPYC 4004 Series processors. Supermicro will feature its new MicroCloud multi-node solution, which supports up to ten nodes in a 3U form factor. This very high-density option is designed for cloud-native workloads.

"Supermicro continues to offer innovative solutions for a wide range of applications, and with this new entry, based on the AMD EPYC 4004 processor, we can address the needs of on-premises or cloud service providers who need a cost-effective solution in a compact form factor," said Charles Liang, president and CEO of Supermicro. "In a single rack, 160 individual nodes can be made available for cloud-native applications, which reduces real estate need and decreases a data center TCO."

ASRock Rack Inc., a leading innovative server company, announces its support for the new AMD EPYC 4004 Series CPUs. The latest BIOS updates for all ASRock Rack AM5 socket products are now available online, ensuring that ASRock Rack motherboards for AMD EPYC 4004 CPUs are ready to support the new processors.

The AMD EPYC 4004 Processors utilize the AM5 socket and feature from 4 to 16 SMT-capable (Simultaneous Multithreading), energy-efficient "Zen 4" processor cores, enabling needed performance in cost-efficient system designs. ASRock Rack launched a complete range of boards and systems based on AM5 socket and pioneered equipping the servers with IPMI since 2022. Now, with the launch of AMD EPYC 4004 Processors, ASRock Rack releases the new BIOS for these servers to leverage AMD official server-grade features such as the support of Windows Server 2022; RHEL 8 and 9; Ubuntu 22.04 and 24.04.

AMD today introduced the EPYC 4004 line of server processors in the Socket AM5 package. These chips come with up to 16 "Zen 4" CPU cores, a 2-channel DDR5 memory interface, and a 28-lane PCIe Gen 5 I/O, and are meant to power small-business servers, as well as cater to the dedicated web-server hosting business that generally attracts client-segment processors. This is the exact segment of market that Intel addresses with its Xeon E-2400 series processors in the LGA1700 package. The EPYC 4004 series offers a superior support and warranty regime compared to client-segment processors, besides ECC memory support, and AMD Secure Processor, and all of the security features you get with Ryzen PRO 7000 series processors for commercial desktops.

AMD's offer over the Xeon E-2400 series is its CPU core count of up to 16, which lets you fully utilize the 16-core limit of the Windows 2022 Server base license. The EPYC 4004 series is functionally the same processor as the Ryzen 7000 "Raphael" except for its ECC memory support. This chip features up to two 5 nm "Zen 4" CCDs with up to 8 cores, each; and an I/O die that puts out two DDR5 memory channels, and 28 PCIe Gen 5 lanes. Besides today's processor launch, several server motherboard vendors are announcing Socket AM5 server boards that are rackmount-friendly, and with server-relevant features.

AMD formally launched the Ryzen 7 8700F and Ryzen 5 8400F Socket AM5 desktop processors. These are variants based on the Ryzen 8000-series desktop APUs, but with their integrated graphics disabled. The 8700F may lack integrated graphics, but includes the Ryzen AI NPU, with up to 16 AI TOPS performance. The 8400F lacks an NPU. Much like the 8700G, the 8700F packs an 8-core/16-thread CPU based on the current "Zen 4" architecture, but with a 100 MHz lower maximum boost frequency of 5.00 GHz. The TDP is the same, at 65 W, and the retail package includes a Wraith Stealth cooler.

The Ryzen 5 8400F is a 6-core/12-thread processor, but much like the 8500G, it is based on the "Phoenix 2" silicon, which has two "Zen 4" cores that can achieve the maximum 4.70 GHz boost frequency for this chip, and four "Zen 4c" that boost lower. Both kinds of cores feature an identical IPC and ISA, and so AMD Chipset Software uses UEFI CPPC preferred cores software flags to prioritize workload to the "Zen 4" cores. AMD in its launch presentation claims that the 8700F should offer competitive gaming and productivity performance to an Intel Core i5-14400F, and that the 8400F should offer gaming performance in the league of an i5-13400F. The company is pricing the 8700F at $269, or $60 cheaper than the 8700G; while the 8400F is priced at $169, or $10 less than the 8500G.

AMD is indeed bringing the Ryzen 7 8700F and Ryzen 5 8400F desktop processors to the retail PIB channel. Both these processors are based on the 4 nm "Hawk Point" or "Phoenix 2" silicon, but with their iGPU disabled, hence the "F" in the model name. Company slides related to the two were leaked to the web. The processors feature CPU cores based on the "Zen 4" microarchitecture, and are built in the Socket AM5 package.

The Ryzen 7 8700F features the 8-core/16-thread "Zen 4" CPU that the 8700G, but with lower CPU clock speeds of up to 5.00 GHz boost (compared to up to 5.10 GHz for the 8700G). Although its iGPU is disabled, its NPU isn't. The Ryzen AI NPU offers 16 AI TOPS performance. The processor retains the 65 W TDP of the 8700G. Moving on to the 8400G, and here we see the processor being based on the "Phoenix 2" silicon, with 6 CPU cores. Two of these are "Zen 4," and can reach the processor's 4.70 GHz maximum boost frequency; while the other four are "Zen 4c," and operate at lower clock speeds. The chip physically lacks an NPU, and its iGPU is disabled. It still has 65 W TDP to feed its CPU cores. In their retail packages, both processors include a Wraith Stealth cooling solution that's meant for 65 W TDP processors.

Following up on last week's launch of the ASTRIA 600 ARGB dual-stack CPU cooler, Thermaltake today introduced its single-stack siblings from the lineup, the ASTRIA 200 ARGB, and the ASTRIA 400 ARGB. The three coolers were unveiled by the company earlier this year at the 2024 CES. Both the 200 and 400 are single fin-stack tower-type CPU coolers. The 200 has a slightly smaller fin-stack, and uses four 6 mm-thick heatpipes, through a direct-touch base; while the 400 uses a slightly heavier fin-stack, six 6 mm-thick heatpipes, and a nickel-plated copper indirect touch base. Thermaltake rates the ASTRIA 200 ARGB for thermal loads of 210 W, while the ASTRIA 400 ARGB is rated at 230 W. Both coolers feature ARGB LED lighting in the form of a diffuser top-plate, and LEDs in the fan.

The ASTRIA 200 ARGB measures 124 mm x 93 mm x 160 mm (L x W x H), while the ASTRIA 400 ARGB measures 124 mm x 94 mm x 160 mm. Both coolers include an identical type of 120 mm fan, which takes in 4-pin PWM input, turns at speeds ranging between 500 and 1800 RPM, pushing up to 65 CFM of airflow, at 2.56 mm H₂O static pressure, and 26.8 dBA of maximum noise. The fan is rated for 40,000 hours. Among the CPU socket types supported by both coolers include LGA1700, the upcoming LGA1851, AM5, AM4, and LGA1200/115x.

AMD Ryzen 9 7900X3D, the 12-core/24-thread Socket AM5 processor with 3D V-cache, is selling at a new low price of just $329. A retailer-specific discount by AntOnline puts the processor at a price lower than the launch price of the Ryzen 7 7700X, and Core i5-14600K. While we haven't had a chance to test this chip, testing by Tom's Hardware puts its gaming performance higher than the Core i9-13900K, with a multithreaded productivity performance in a similar range. The 7900X3D probably suffers from bad sales due to the popularity of the Ryzen 7 7800X3D, which remains the fastest gaming processor, and the 7950X3D, which is AMD's flagship processor.

That's not all, prices of even some of the recently launched processors for the older Socket AM4 platform are on a slope, which could attract sales from those that want to upgrade. The Ryzen 7 5700X3D is a slightly slower version of the 5800X3D—the fastest gaming processor for AM4, with a gaming performance rivaling the Core i9-12900K. This new chip can be had at just $229 on Amazon US. The Ryzen 7 5800X was once a solid gaming processor when AMD dominated Intel's 10th- and 11th Gen, it's now going for just $179.

Thermaltake today announced the ASTRIA 600 ARGB, a dual fin-stack type CPU cooler. The company had shown off the ASTRIA line of coolers earlier this year at the 2024 CES. The ASTRIA 600 leads the pack, being the heaviest model, with the most heat dissipation area from its dual-stack design. Its design involves a nickel-plated copper base, from which six 6 mm-thick copper heat pipes make their way through two aluminium fin-stacks with equal fin-pitch to each other. Both fin-stacks are capped by die-cast metal top-plates with ARGB lighting from 18 LEDs, each. Two 120 mm fans ventilate the fin-stacks.

Each of the two included 120 mm fans features a 40,000-hour rated bearing, and a 9-LED ARGB lighting that projects from the impeller hub. The fan takes in 4-pin PWM for its main function, turns at speeds ranging between 500 and 1,800 RPM, pushing up to 65 CFM of airflow, at 2.56 mm H₂O static pressure, and up to 26.8 dBA noise. Even with both fans in place, Thermaltake says you have clearance for 1.5x-tall memory modules (ones that have lighting or heatsink crowns). The cooler has a cooling capacity of 265 W, making it fit for any of the flagship desktop processors. Among the CPU socket types supported are LGA1700, upcoming LGA1851, LGA1200/LGA115x, AM5, and AM4. The cooler measures 124 mm x 137 mm x 160 mm (L x W x H). The company didn't reveal pricing.

ASRock Technology, a global leader in motherboard manufacturing, today announced the release of the latest AGESA beta BIOS for AM5 motherboards, enabling support for next-generation Ryzen processors. ASRock AM5 motherboard lineup can now support next-generation AMD Ryzen processors with the installation of the latest new AGESA 1.1.7.0 beta BIOS, significantly improving processor compatibility and providing users of ASRock AM5 motherboards with enhanced Ryzen processor support.

Users can easily update to the latest AGESA 1.1.7.0 beta BIOS through ASRock official website or using features like BIOS Flashback and Instant Flash. ASRock recommends that users update to the latest BIOS version as soon as possible to achieve better compatibility and system performance. The official version is expected to be released later, so please stay tuned to the ASRock official website for the latest updates.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, today is excited to announce a brand-new BIOS update designed for its AMD AM5 series motherboards, incorporating the latest AGESA PI 1.1.7.0 Patch A architecture. This update is aimed at the imminent release of AMD's next-generation CPUs, ensuring that BIOSTAR motherboards are primed to unleash the full potential of these cutting-edge processors. With a strong focus on future-ready performance, this BIOS update will be available to download soon and is ready to redefine computing power and performance with the latest AMD processors. BIOSTAR invites users to stay tuned to its official website for the BIOS release and future updates.

AMD is readying a new line of EPYC branded server processors in the Socket AM5 package, VideoCardz reports. The new processor lineup is being built to target two distinct classes of customers—small business servers, and data-centers selling small-size dedicated servers that were otherwise having to offer Ryzen chips. Intel currently has the Xeon E-2400 series "Raptor Lake-E" processors in the Socket LGA1700 package to target these exact kinds of customers. The EPYC 4004 series will be based on the same "Raphael" package as the Ryzen 7000 series, and will be a step up from the Ryzen PRO 7000 series. What sets the Ryzen PRO 7000 apart from the EPYC 4004 series are the target markets. The Ryzen PRO series target commercial desktops. Perhaps the biggest differentiator between EPYC 4004 and Ryzen PRO 7000 series is the support and warranty AMD provides to its server processors.

The "Raphael" package gives the EPYC 4004 series CPU core counts ranging between 6 and 16. These CPU cores are based on the "Zen 4" microarchitecture. The memory controllers in the I/O die will probably be reconfigured to support server memory densities, besides ECC support like on the Ryzen PRO 7000 series. There's even talk of variants with 3D V-cache, although it remains to be seen if the 12-core and 16-core variants are similar to the 7900X3D and 7950X3D, where only one of the two CCDs has 3D V-cache; or if they're the chip we all dreamed about—a "Raphael" with both CCDs featuring 3D V-cache. There are already Socket AM5 motherboards by companies such as Advantech, which are server-grade, with server-relevant I/O, like the one pictured below, and so the ecosystem for EPYC 4004 series already exists, along with upgrade headroom for future generations.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, released the latest AGESA 1.1.7.0 beta bios for the coming AMD Ryzen 9000 series processors boot-up support on GIGABYTE AM5 X670, B650, A620 motherboards, and for present Ryzen 7000 and 8000 series processors as well.⁠ The AGESA 1.1.7.0 beta BIOS is now ready on the GIGABYTE official website, and the formal release will be in mid-May. Users can easily update the BIOS using GIGABYTE's ＠BIOS, Q-Flash, or Q-Flash Plus technology. For more update, please pay close attention to the official GIGABYTE website.

AMD is reportedly planning to launch the Ryzen 7 8700F and Ryzen 5 8400F Socket AM5 desktop processors for a global launch, in the retail channel, as boxed processors. The two chips had launched earlier this month in the Chinese retail market. The 8700F reportedly comes with an OPN of 100-100001590BOX, while the 8400F is marked 100-100001591BOX. The "F" in both SKUs denotes a lack of integrated graphics. The Ryzen 7 8700F is an 8-core/16-thread processor based on the 4 nm "Hawk Point" silicon, while the 8400F is a 6-core/12-thread processor based on "Phoenix 2," which offers two "Zen 4" cores that run at higher clock speeds, and four "Zen 4c" cores that run at lower speeds.

The lack of an iGPU isn't the only thing differentiating the 8700F from the 8700G, the new chip even comes with slightly lower CPU clock speeds—100 MHz lower base and maximum boost frequencies. The 8700F CPU runs at a base frequency of 4.10 GHz, with 5.00 GHz maximum boost, when compared to the 4.20/5.10 GHz speeds of the 8700G. The 8400F, on the other hand, runs at 4.20 GHz base frequency, and a 4.70 GHz maximum boost frequency that applies to at least its two "Zen 4" cores; its four "Zen 4c" cores run at lower frequencies. There is no word on pricing. One reason you could want an 8700F over something like a 7700 would be its appetite for memory overclocking, if you can overlook the lack of integrated graphics, a smaller L3 cache, and most importantly, the lack of PCIe Gen 5, and four fewer PCIe lanes.

MSI is here to announce the latest AGESA ComboPI 1.1.7.0 Patch A BIOS update for AM5 next gen CPU support on X670E, X670, B650, A620 motherboards. Users would simply need to update the BIOS to the latest version accordingly. MSI will continue to update the latest news for our users. Please follow MSI's official channels and check the product pages for the latest BIOS updates to guarantee optimal experience, heightened performance, and enhanced stability.

For more about MSI AMD 600 series motherboards, please check here.

Over a year ago, EK Water Blocks introduced its first mainstream CPU water block, designed explicitly for delidded Intel CPUs. Since its debut, there has been a significant increase in users opting to delid their CPUs to enhance performance. Building on this trend, EK just recently released the market's first-ever All-In-One CPU cooler tailored for delidded Intel CPUs, a product that has received highly positive feedback and reception. EK, as the market leader in high-performance PC liquid cooling, is committed to constant innovation and bringing the best user experience on the market. They're reaffirming this commitment by announcing several upcoming products designed for direct die cooling. For those unfamiliar with delidding and direct die cooling, we recommend checking out EK's blog post on the topic.

First up is the highly anticipated EK Direct Die solution for Socket AM5 AMD Ryzen CPUs. Countless hours of engineering and testing were invested into these products to ensure consistent performance results and a user-friendly installation process. Unlike other solutions that require modifying an existing cold plate, this water block features a cold plate specifically designed for delidded AM5 Ryzen 7000 Series CPUs. The mounting mechanism differs from the Velocity² Direct Die water block, as it relies on standoffs at the four corners of the water block instead of the cold plate making contact with the die guard. The entire fin structure has been adjusted to direct 100% of the flow over the chiplets themselves, but more details on this topic will be available in the following days when these AMD-specific Direct Die CPU water blocks become available for order.

Akasa today introduced the ALUCIA H4A, a low-profile air-type CPU cooler for AMD sockets AM5 and AM4. With its fan in place, the cooler has a Z-height of just under 30 mm, which it achieves using a highly compacted fin-stack heatsink, and a thin form-factor fan. The cooler can deal with AMD Ryzen processors with TDP of up to 95 W, which should make it fit for the majority of processor- and APU models. Its design involves a nickel-plated copper base located between a factory-fitted retention-module. From this base, four 6 mm-thick copper heatpipes pass through, conveying heat to an aluminium fin-stack heatsink, which is ventilated by a 92 mm fan.

The Akasa ALUCIA H4A measures 94 mm x 94 mm x 29.5 mm (WxDxH), weighing 232 g. Its 92 mm ball-bearing fan is rated for 40,000 hours by its designers. It takes in 4-pin PWM input, and turns at speeds ranging between 800-3,600 RPM. It pushes a maximum of 40 CFM of airflow, at 2.2 mm H₂O static pressure, and noise ranging between 17-35.8 dBA. The company didn't reveal pricing, but mentioned that the cooler is backed by a 2-year warranty.

An alleged picture of an unreleased AMD Ryzen 9000 series "Granite Ridge" desktop processor, just hit the wires. "Granite Ridge" is codename for the desktop implementation of the "Zen 5" microarchitecture, it succeeds the current Ryzen 7000 "Raphael" that's powered by "Zen 4." From what we're hearing, the CPU core counts of "Granite Ridge" continue to top out at 16. These chips will be built in the existing AMD Socket AM5 package, and will be compatible with existing AMD 600-series chipset motherboards, although the company is working on a new motherboard chipset to go with the new chips.

The alleged AMD engineering sample pictured below has an OPN 100-000001290-11, which is unreleased. This OPN also showed up on an Einstein@Home online database, where the distributed computing platform read it as having 16 threads, making this possibly an 8-core/16-thread SKU. The "Zen 5" microarchitecture is expected to provide a generational IPC increase over "Zen 4," but more importantly, offer a significant performance increase for AVX-512 workloads due to an updated FPU. AMD is expected to unveil its Ryzen 9000 series "Zen 5" processors at the 2024 Computex.

Shipping manifests appear to be great sources of pre-release information—only a few hours ago, the existence of prototype AMD "Strix Point" and "Fire Range" mobile processors was highlighted by hardware sleuth harukaze5719. A related leak has appeared online fairly quickly after the discovery of laptop-oriented "Zen 5" chips. momomo_us joined in on the fun, with their exposure of speculated desktop silicon. Two brand-new AMD OPN codes have been linked to the upcoming "Granite Ridge" series of AM5 processors.

100-000001404-01 is likely an eight-core/ sixteen-thread "Zen 5" Ryzen CPU with a 170 W TDP—a stepping designation, B0, indicates engineering sample status. The other listing, 100-000001290-21, seems to be an A0-type engineering sample—leaked info suggests that this a six-core/twelve-thread (105 W TDP) next-gen mainstream desktop processor. AMD is likely nearing the finish line with its Ryzen 9000-series—a new generation of chipsets, including X870E, is reportedly in the pipeline. Additionally, VideoCardz posits that a refresh of 700-series boards could be on the cards. "Granite Range" CPUs are expected to retain the current-gen 6 nm client I/O die (cIOD), as sported by "Raphael" Ryzen 7000-series desktop processors.

Colorful Technology Company Limited, a leading brand in gaming PC components, gaming laptops, and Hi-fi audio products, proudly presents the CVN B650M GAMING FROZEN motherboard. This motherboard is our first AMD AM5 motherboard that supports the AMD Ryzen 7000 Series and the latest AMD Ryzen 8000 Series processors that feature the groundbreaking AMD Ryzen AI technology as well as support for AVX-512.

The CVN B650M GAMING FROZEN supports the latest AMD Ryzen 8000G Series APUs with AMD Ryzen AI technology. It also supports the AMD Ryzen 7000 and AMD Ryzen 7000 X3D Series processors with 3D V-Cache Technology, as well as support for the future AM5 processors. AMD Ryzen AI brings the power of personal computing closer to you on an AI PC, unlocking a whole new level of efficiencies for work, collaboration, and innovation so that you can stay connected better with the world around you.

Last week, the Professional Gamers League (PGL) announced an interesting overhaul of tournament hardware—new systems will be fitted with NVIDIA GeForce RTX 4080 graphics cards, then hooked up to BenQ ZOWIE XL2566K 24.5" 360 Hz gaming monitors. Their previous generation machines were (initially) designed around AMD's Ryzen 9 5950X processor, but the organization is leaving AM4 platforms behind: "PGL is excited to announce that our team has fully optimized upgraded gaming PCs in partnership with Afromnazareth, and we are ready to deliver an unparalleled esports experience at the PGL CS2 Major Copenhagen 2024. At the heart of this cutting-edge setup is the AMD Ryzen 7 7800X3D processor, explicitly chosen for its exceptional performance capabilities and ability to handle the demands of CS2. This processor is renowned for its superior gaming performance, offering players the speed, power, and efficiency required to perform at the highest levels of competition."

The Ryzen 7 5800X3D is a more straightforward upgrade—as an easy drop-in for the PGL's older AM4 platform machines, but a leap into new ecosystems will grant a bit of future-proofing. Team Red is expected to support AM5 across a couple of processor generations. PGL did upgrade systems with 5800X3D CPUs, due to player feedback—according to Tom's Hardware: "there was some discontent among players with the previous configuration with the Ryzen 9 5950X because, while the chip sports 16 Zen 3 execution cores, Counter-Strike 2 doesn't exploit the processor's prowess. Some players criticized PGL's poor processor choice for previous events, claiming lousy frame rates." Performance connoisseurs will be pleased to hear about the tournament organizer's new push into modern platforms—Silviu Stroie, PGL CEO, stated: "we have meticulously optimized this bespoke gaming setup to ensure that every participant experiences CS2 in the highest fidelity without compromise. The AMD Ryzen 7 7800X3D CPU stands out as a game-changer in the esports arena, promising to elevate the competitive play of CS2 to new heights."

Noctua today expanded its chromax.black line with an all-black version of the award-winning low-height 120 mm CPU cooler NH-D12L: Staying true to the successful formula of the original model, the new chromax.black version with its black fans and black coated heatsink combines the same signature quiet cooling performance with a sleek stealth look.

"The NH-D12L has become a popular choice for compact, high performance builds in cases like the Lian Li O11 Dynamic or the DAN C4-SFX ", says Roland Mossig (Noctua CEO). "With the new chromax.black version, we're now giving customers the option to leverage the NH-D12L's renowned quiet cooling performance in all-black systems."

DeepCool, a leader in innovative cooling solutions, proudly presents the ASSASSIN 4S, its next evolution in an already proven award winning air cooler that redefines elegance, performance, and ease of installation in the PC building market. The ASSASSIN 4S is a testament to sophistication, blending substantial thermal dissipation and silent operation with a sleek aesthetic. Boasting a simple yet refined design, the ASSASSIN 4S features seven heat pipes intricately routed through dual, black-coated fin towers, complemented by an improved 140 mm Fluid Dynamic Bearing (FDB) fan. This design not only enhances cooling performance but also ensures unobstructed RAM clearance, catering to the demands of modern high-powered processors.