Simply NUC, a global leading provider of customized PC solutions, proudly announced its most ambitious product launch to date: BMC-Enabled extremeEDGE Servers. Representing a massive leap in edge computing technology, the new product family of servers are positioned to reshape how businesses manage and process data in an ever-evolving digital landscape.

Traditional servers are bulky, expensive, and inefficient for edge computing applications. However, extremeEDGE Servers revolutionize this paradigm. Equipped with NANO-BMC technology, the product line offers server-like manageability in ultra-efficient compute nodes, resulting in enhanced energy efficiency by "right-sizing" hardware for specific workloads. Integrating AI inference at the edge enables machine learning directly at the source, reducing costs, machine power, network latency, and bandwidth usage compared to cloud-based solutions.

AMD Radeon Anti-Lag+ is making a comeback with the game that caused it go away in the first instance—Counter Strike 2. The technology is undergoing a rebranding as Anti-Lag 2, to reflect the several under-the-hood changes made by AMD. AMD Radeon Anti-Lag+ was supposed to be AMD's answer to NVIDIA Reflex, a whole-system latency reduction technology that wouldn't just benefit competitive online games such as Counter Strike 2; but also form an essential component of FSR 3 Frame Generation. The technology briefly launched last year before gamers started noticing that the tech would trigger anti-cheat mechanisms in online games, such as the VAC that polices CS 2, forcing AMD to withdraw the technology, and for Valve to manually detect and restore thousands of gamer accounts.

It seems AMD has fixed the way Anti-Lag+ works with the new Anti-Lag 2 technology. The company in particular is testing its stability with Counter Strike 2, so you don't get banned again by VAC. The company worked with Valve to release an update to the game so it supports the tech, and released a special AMD Software Adrenalin Anti-Lag 2 Preview driver based on the recent 24.5.1 version. You'll need the latest patch to CS 2, and this driver to experience the "technical preview" of Anti-Lag 2. The company also released a technology brief of Anti-Lag 2. The most important change with Anti-Lag 2 that sets it apart from the failed Anti-Lag+, is that it is not a driver-based solution, but rather a game engine-based one. This is why you'll need the latest update to CS 2, because it contains the Anti Lag 2 code.

AMD's future "Zen 6" CPU microarchitecture is rumored to cram up to 32 cores per CCD (CPU complex die), or the common client/server chiplet with the CPU cores, according to Kepler_L2, a reliable source with hardware leaks. At this point it's not clear if they are referring to the regular "Zen 6" CPU core, or the physically compacted "Zen 6c" core meant for high core-count cloud server processors. The current pure "Zen 4c" CCD found in EPYC "Bergamo" processor packs 16 cores across two 8-core CCX (CPU core complexes) that share a 16 MB L3 cache among the 8 cores within the CCX. The upcoming "Zen 5c" CCD will pack 16 cores, but in a single 16-core CCX that shares 32 MB of L3 cache among the 16 cores for improved per-core cache access. "Zen 6" is expected to double this to 32 cores per CCD.

The 32-core CCD powered by "Zen 6" (likely Zen 6c), might take advantage of process improvements to double the core-count. At this point, it's not clear if this jumbo CCD features a single large CCX with all 32 cores sharing a large L3 cache; or if it's using two 16-core CCX that shares, say, 32 MB of L3 cache among the 16 cores. What's clear with this leak, though, is that AMD is looking to continue ramping up CPU core counts per socket. Data-centers and cloud customers seem to love this, and AMD is the only x86 processor maker in a serious competition with Arm-based server processor manufacturers such as Ampere, to increase significantly increase core counts per socket with each generation.

GIGABYTE Technology, Giga Computing, a subsidiary of GIGABYTE and an industry leader in AI servers, server motherboards, and workstations, today announced its support of AMD EPYC 4004 Series processors on AM5 socket servers and server motherboards for entry-level enterprise customers. This will require a BIOS update, which will come pre-installed in the near future.

The new AMD EPYC 4004 platform, built on the AM5 socket, delivers enterprise-grade features that allow small businesses and cloud services to have dependable daily operations with minimal downtime. For reliability and manageability, the platform has been validated for compatibility with server operating systems: Ubuntu, RHEL, and Windows Server. By doing so IT administrators can better control and monitor systems, as well as protect businesses against cyberthreats.

Today at Microsoft Build, AMD (NASDAQ: AMD) showcased its latest end-to-end compute and software capabilities for Microsoft customers and developers. By using AMD solutions such as AMD Instinct MI300X accelerators, ROCm open software, Ryzen AI processors and software, and Alveo MA35D media accelerators, Microsoft is able to provide a powerful suite of tools for AI-based deployments across numerous markets. The new Microsoft Azure ND MI300X virtual machines (VMs) are now generally available, giving customers like Hugging Face, access to impressive performance and efficiency for their most demanding AI workloads.

"The AMD Instinct MI300X and ROCm software stack is powering the Azure OpenAI Chat GPT 3.5 and 4 services, which are some of the world's most demanding AI workloads," said Victor Peng, president, AMD. "With the general availability of the new VMs from Azure, AI customers have broader access to MI300X to deliver high-performance and efficient solutions for AI applications."

Today, TYAN, a leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, introduced its latest offering: affordable and high-performance servers and motherboards powered by the new AMD EPYC 4004 Series CPUs. "The new AMD EPYC 4004 Series CPUs, along with our strong ecosystem of technology partners, bring enterprise solutions to a traditionally underserved market and ensure that small and medium businesses have access to highly-performant technologies that help them stay competitive," said John Morris, corporate vice president, Enterprise and HPC Business Group, AMD. "The AMD EPYC 4004 CPUs fill an important market gap, providing cost-optimized solutions with enterprise-grade dependability, scalability and security in cost-optimized system configurations that make sense for smaller businesses and dedicated hosters."

AMD EPYC 4004 Series processors complement the broad AMD EPYC processor offering, extending the established high performance, highly efficient "Zen4" core architecture into an expanded range of entry level system designs desired by small business customers as well as regional hosted IT services providers. With new low core count CPU offerings and TDP ranges as low as 65 W, attractively priced server systems featuring AMD EPYC 4004 Processors deliver the strong performance, scalability and dependability needed by growing businesses and 24x7 hosted services. With an optimized, single-socket package, 2 channels of DDR5 memory and up to 28 lanes of Gen 5 PCIe connectivity, these servers offer a compelling balance of performance and scalability in an affordable, easy-to-deploy, easy-to-manage package.

Supermicro, Inc., a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, is announcing additions to the AMD based H13 generation of CPU Servers, optimized to deliver an outstanding balance of performance and efficiency and powered by the AMD EPYC 4004 Series processors. Supermicro will feature its new MicroCloud multi-node solution, which supports up to ten nodes in a 3U form factor. This very high-density option is designed for cloud-native workloads.

"Supermicro continues to offer innovative solutions for a wide range of applications, and with this new entry, based on the AMD EPYC 4004 processor, we can address the needs of on-premises or cloud service providers who need a cost-effective solution in a compact form factor," said Charles Liang, president and CEO of Supermicro. "In a single rack, 160 individual nodes can be made available for cloud-native applications, which reduces real estate need and decreases a data center TCO."

ASRock Rack Inc., a leading innovative server company, announces its support for the new AMD EPYC 4004 Series CPUs. The latest BIOS updates for all ASRock Rack AM5 socket products are now available online, ensuring that ASRock Rack motherboards for AMD EPYC 4004 CPUs are ready to support the new processors.

The AMD EPYC 4004 Processors utilize the AM5 socket and feature from 4 to 16 SMT-capable (Simultaneous Multithreading), energy-efficient "Zen 4" processor cores, enabling needed performance in cost-efficient system designs. ASRock Rack launched a complete range of boards and systems based on AM5 socket and pioneered equipping the servers with IPMI since 2022. Now, with the launch of AMD EPYC 4004 Processors, ASRock Rack releases the new BIOS for these servers to leverage AMD official server-grade features such as the support of Windows Server 2022; RHEL 8 and 9; Ubuntu 22.04 and 24.04.

MSI, a leading global server provider, today announced the availability of high-performance server platforms supporting AMD EPYC 4004 Processors for small and medium businesses and regional-hosted IT service providers to deliver essential security capabilities and energy efficiency. "Businesses across all scales are discovering the advantages of advanced computing, connectivity, and analytics capabilities as applications and services become more widespread," said Danny Hsu, General Manager of Enterprise Platform Solutions. "MSI server platforms, supporting AMD EPYC 4004 Processors, empower our customers to implement high-performance computing with cost-effective, ease of deployment, and manageability features. This capability addresses challenges such as system costs, limited IT expertise, and other infrastructure constraints that were previously prohibitive."

"The new AMD EPYC 4004 Series CPUs, along with our strong ecosystem of technology partners, bring enterprise solutions to a traditionally underserved market and ensure that small and medium businesses have access to highly-performant technologies that help them stay competitive," said John Morris, corporate vice president, Enterprise and HPC Business Group, AMD. "The AMD EPYC 4004 CPUs fill an important market gap, providing cost-optimized solutions with enterprise-grade dependability, scalability and security in cost-optimized system configurations that make sense for smaller businesses and dedicated hosters."

According to the Taiwan Central News Agency AMD is considering opening up an R&D center in Taiwan. AMD is said to have applied with the Ministry of Economic Affairs (MOEA) as part of Taiwan's "A+ global R&D and innovation partnership program" to set up a new R&D facility. The government partnership program covers three types of fields, namely AI, new-generation semiconductors including high-power and high-frequency ICs, and new 5G network structures and it's aiming for both local and international businesses to set up new R&D centers. AMD has yet to announce any plans about the potential R&D center and the MOEA has declined to share any details with local media in Taiwan.

However, an unnamed source with inside knowledge in the matter has revealed that AMD is looking at investing around NT$5 billion (~US$155 million), based on the application. The same source also mentioned that the MOEA has stipulated conditions that AMD has to meet, which among other things involves working with local IC design companies to help further develop Taiwan's IC design industry, working with local companies to produce servers with AI chips and working with local universities to cultivate talent. Furthermore, the MOEA is said to have asked AMD to recruit at least 20 percent of its R&D centre workforce from outside of Taiwan, to avoid competing with local companies for staff. AMD could be making an announcement about the R&D center at Computex, but it's worth keeping in mind that these things take time. Back in 2021, NVIDIA announced that it would set up an R&D center in Taiwan, but with a much bigger budget of NT$24.3 billion plus a government subsidy of a further NT$6.7 billion. NVIDIA has as yet to announce the opening of its Taiwan R&D center.

AMD today introduced the EPYC 4004 line of server processors in the Socket AM5 package. These chips come with up to 16 "Zen 4" CPU cores, a 2-channel DDR5 memory interface, and a 28-lane PCIe Gen 5 I/O, and are meant to power small-business servers, as well as cater to the dedicated web-server hosting business that generally attracts client-segment processors. This is the exact segment of market that Intel addresses with its Xeon E-2400 series processors in the LGA1700 package. The EPYC 4004 series offers a superior support and warranty regime compared to client-segment processors, besides ECC memory support, and AMD Secure Processor, and all of the security features you get with Ryzen PRO 7000 series processors for commercial desktops.

AMD's offer over the Xeon E-2400 series is its CPU core count of up to 16, which lets you fully utilize the 16-core limit of the Windows 2022 Server base license. The EPYC 4004 series is functionally the same processor as the Ryzen 7000 "Raphael" except for its ECC memory support. This chip features up to two 5 nm "Zen 4" CCDs with up to 8 cores, each; and an I/O die that puts out two DDR5 memory channels, and 28 PCIe Gen 5 lanes. Besides today's processor launch, several server motherboard vendors are announcing Socket AM5 server boards that are rackmount-friendly, and with server-relevant features.

AMD is slated to deliver a "Zen 5" microarchitecture deep-dive at the Hot Chips 2024 conference, on August 25. The company is widely expected to either unveil or announce its next-generation processors based on the architecture, in its 2024 Computex keynote on June 3, so it remains to be seen if the deep-dive follows a product launch, or predates it. Either way, Hot Chips talks tend to be significantly more detailed than the product launch pre-briefs that we get; and so we hope to learn a lot more about the architecture.

A lot rides on the continued success of "Zen 5" to deliver a double-digit percentage IPC increase over its predecessor, while also introducing new microarchitecture-level features; and leveraging new foundry processes at TSMC, to deliver competitive processors to Intel. Unlike Intel, which has implemented hybrid CPU cores across its product stack, AMD continues to make traditional multicore processors, and refuses to level even the chips that contain regular and high-density versions of its "Zen 4" cores as "hybrid."

AMD on Monday said that its 2024 Computex Keynote address slated for June 3, will see a slew of next-generation product announcements. "Join us as Dr. Lisa Su delivers the Computex 2024 opening keynote and shares the latest on how AMD and our partners are pushing the envelope with our next generation of high-performance PC, data center and AI solutions," the brief release said.

AMD is widely expected to unveil its next-generation Ryzen 9000 "Strix Point" mobile processors for AI PCs capable of powering the recently announced Microsoft Copilot+, its next-generation Ryzen 9000 "Granite Ridge" desktop processors, its 5th Generation EPYC "Turin" server processors, and possibly even its next-generation Radeon RX RDNA 4 generation. At the heart of all its processor announcements is the new "Zen 5" CPU microarchitecture that's expected to introduce an over 10% IPC improvement with significant improvements in AVX512 performance over "Zen 4," which should benefit certain kinds of AI workloads.

TrendForce reports that the three largest DRAM suppliers are increasing wafer input for advanced processes. Following a rise in memory contract prices, companies have boosted their capital investments, with capacity expansion focusing on the second half of this year. It is expected that wafer input for 1alpha nm and above processes will account for approximately 40% of total DRAM wafer input by the end of the year.

HBM production will be prioritized due to its profitability and increasing demand. However, limited yields of around 50-60% and a wafer area 60% larger than DRAM products mean a higher proportion of wafer input is required. Based on the TSV capacity of each company, HBM is expected to account for 35% of advanced process wafer input by the end of this year, with the remaining wafer capacity used for LPDDR5(X) and DDR5 products.

With handheld gaming devices being all the rage these days, thanks to PC manufacturers getting into the form-factor; the conditions seem ripe for a new PlayStation handheld generation. Rumors of Sony working on a new gaming handheld first surfaced in February 2024 from a Moore's Law is Dead report, and now other leakers are resonating the theory. This is a fully fledged handheld console that runs games locally, unlike the PlayStation Portal, which was a cloud gaming endpoint device.

The PlayStation 4 debuted a decade ago, with SoC hardware specs that can easily be match by current-generation AMD Ryzen Z1 APUs, in handheld console power footprints; and the leakers tend to agree—the new handheld console will be able to play all the games from the PlayStation 4 library, besides its own unique crop of games that take advantage of certain handheld human interface features, such as a touchscreen, accelerometer, and gyro.

The latest update of Ghost of Tsushima lets you use DLSS 2 super-resolution and FSR 3 Frame Generation simultaneously, so you have the unique benefit of having the NVIDIA DLSS 2 handle super resolution and image quality, while letting the AMD FSR 3 nearly double frame-rates of the DLSS 2 output. All this, without the need for any mods, it's part of the game's original code. It's crazy when you think about it—you now have two performance enhancements running in tandem, with gamers reporting over 170 FPS at 4K with reasonably good image quality. This could particularly benefit those on older GeForce RTX 30-series "Ampere" and RTX 20-series "Turing" graphics cards, as those lack support for DLSS 3 Frame Generation.

XFX earlier this month debuted the Phoenix Nirvana line of premium custom-design Radeon RX 7900 series graphics cards with the China-exclusive RX 7900 XTX Phoenix Nirvana. The company is expanding this lineup with two new models, both of which are draped in white. These are the company's first white-themed graphics cards. The lineup now includes the Radeon RX 7800 XT Phoenix Nirvana White, and the RX 7900 GRE Phoenix Nirvana White. Both cards appear to share a common board design, because the compacted "Navi 31" ASIC powering the RX 7900 GRE is pin-compatible with the "Navi 32" ASIC that the RX 7800 XT is based on. Since both GPUs feature a 256-bit GDDR6 memory interface, and a nearly identical typical board power value of around 260 W, AMD's board partners get to use their RX 7800 XT custom board designs for RX 7900 GRE products.

The XFX RX 7900 GRE Phoenix Nirvana White features a significantly different board design to the company's Merc 319 product that's available in the west. The heatsink is noticeably larger, the cooler shroud appears better ventilated, and XFX is using thicker 100 mm fans for higher static pressure than from the ones you find in the global Merc 319 card. The most striking design element of course is its color trim. White makes up the cooler shroud, the fan impellers, and the backplate. The heatsink protrudes out of the edges of the black PCB that's barely noticeable. The card is 33.7 cm long, and 5.9 cm-thick, with a 13.2 cm height. The RX 7900 GRE Phoenix Nirvana White comes with a hearty 6.7% factory overclock, with a 2394 MHz boost clock (vs. 2245 MHz reference); while the RX 7800 XT Phoenix Nirvana White ticks AMD reference 2430 MHz boost. Both these cards, unfortunately, are China-exclusive products, just like the RX 7900 XTX card XFX launched earlier this month.

Sapphire today unveiled the Radeon RX 7700 XT Pure Frostpunk 2 Edition graphics card. The card is a branding collaboration with 11 bit Studios, which releases Frostpunk 2 this July. The city-building survival strategy game is one of this Summer's most anticipated game releases. Sapphire celebrates it with a variant of the RX 7700 XT Pure graphics card that has a game code for the Deluxe Edition of Frostpunk 2, a themed backplate, and some goodies in the box, including custom keycaps, and enamel pin badges. While the backplate is heavily themed on the game, the all-white cooler shroud, the white impellers for the three fans, and the rest of the card, sticks with the white color scheme that's characteristic of Sapphire's Pure brand. The card comes in a collector's edition box themed after the game.

Based on the 5 nm "Navi 32" silicon, the Radeon RX 7700 XT features 3,456 stream processors across 54 compute units. The GPU is based on the RDNA 3 graphics architecture, and AMD recommends it for 1440p gaming with maxed out settings. The card features 12 GB of 18 Gbps GDDR6 memory across a 192-bit wide memory interface, and features 48 MB of Infinity Cache memory. The card draws power from a pair of 8-pin PCIe power connectors. Display outputs include two each of DisplayPort 2.1 (featuring UHBR 13.5), and two HDMI 2.1 connectors. The card will release to market in July, probably alongside the game's July 25 release date, pricing isn't known yet (we asked Sapphire).

AMD earlier this month released documentation for the Micro Engine Scheduler (MES) firmware of its RDNA 3 GPUs. The MES is a hardware component that distributes graphics processing and general-purpose compute workloads among the main number-crunching machinery of the AMD GPU—the shader engines, which contain the compute units (CU), the indivisible SIMD muscle of the GPU with programmable shaders and certain kinds of specialized hardware, such as the AI Accelerator and Ray Accelerator. The MES is driven by a programmable firmware, which is what AMD released developer documentation of.

The decision to release MES documentation probably comes from the very top of AMD corporate management. In March, a controversy erupted when Tiny Corp, builders of AI compute servers and workstations, complained of issues testing the Radeon RX 7900 XTX graphics card with a ROCm compute stack, prompting a response from no less than CEO Dr Lisa Su. There were then calls to open-source the firmware, which AMD didn't agree to, probably since it treads on their core GPU hardware IP; but the company did the next best thing, by releasing detailed developer documentation for the MES firmware.

AMD is rumored to be discontinuing driver support for the Windows 10 operating system for its next-generation mobile processors, starting with the upcoming Ryzen 9000 "Strix Point" (and possibly "Strix Halo" and other chips from the generation). This would mean a lack of official drivers for the XDNA 2 NPU, SoC components, and possibly even the iGPU. This who know their way around manual driver installation might have some luck getting the Windows 11 drivers to work on Windows 10, but for the most part, notebooks and pre-built SFF desktops powered by these chips will not come with Windows 10 preinstalled, since there won't be any official drivers from AMD.

The CPU of Ryzen 9000 "Strix Point" processors should still very much work with Windows 10. This however doesn't cover the upcoming Ryzen 9000 "Granite Ridge" desktop processors, which have minimal hardware that need drivers, except for the basic iGPU they pack. Microsoft is discontinuing Windows 10 from regular updates on October 14, 2025. Those who want to hold on to the operating system need to pay for extended security update plans that get progressively pricier with each year.

ASUS introduced the Radeon RX 7900 XTX and RX 7900 XT DUAL OC graphics cards. The two join ASUS's rather slim RX 7900 series custom-design lineup, which until now only included the TUF Gaming OC products for the RX 7900 XT and RX 7900 XTX. ASUS's common board design for the cards it's launching, features a large cooler shroud, a tall, yet triple-slot board design, and a cooling solution that uses an aluminium fin-stack heatsink that uses no more than two Axial-Tech fans, hence the name DUAL OC. We've seen this exact board design on some of the RTX 30-series "Ampere" DUAL OC products, so ASUS may probably be carrying over the design, with suitable changes for compatibility with the "Navi 31" GPU.

Both the RX 7900 XTX and RX 7900 XT DUAL OC cards feature a milder factory overclock compared to the company's TUF Gaming OC products. The RX 7900 XTX DUAL OC does 2455 MHz Game clock (compared to 2365 MHz reference); while the RX 7900 XT DUAL OC offers 2075 MHz Game clocks compared to 2025 MHz AMD reference. It's also interesting to note here, that the RX 7900 XTX/XT DUAL OC cards feature a significantly different board design than the RX 7900 GRE DUAL OC, which features a design closer to that of the RX 7800 XT DUAL OC. Both the RX 7900 XT DUAL OC and RX 7900 XTX DUAL OC feature triple 8-pin PCIe power connectors, and display I/O that includes three DisplayPort 2.1, and one HDMI 2.1. Besides the minimal RGB, the cards offer dual-BIOS, with the Q-BIOS running them at reference speeds, and with a tighter fan curve. The card measures 32.3 cm in length, 14.7 cm in height, and is no more than 3 slots thick. The company didn't reveal pricing.

AMD today released the latest version of the AMD Software Adrenalin Edition drivers. Version 24.5.1 WHQL comes with optimization for Ghost of Tsushima Director's Cut, Senua's Saga: Hellblade II, and F1 24. AMD added HYPR-Tune support for Ghost of Tsushima Director's Cut, Horizon Forbidden West Complete Edition, Starfield, and The Last of Us Part I. AMD also says that these drivers offer optimal support for AI acceleration on Radeon 7000 series RDNA 3 graphics cards.

Among the issues fixed with this release include an intermittent driver timeout or crash observed when playing World of Warcraft or World of Warcraft Classic on RDNA 3 GPUs; a similar issue with Overwatch 2 on Radeon RX 5000 series GPUs; an intermittent stutter after alt+tab with performance metrics overlay enabled; and corruption with certain water elements when playing Alan Wake 2 with Radeon Boost enabled.

DOWNLOAD: AMD Software Adrenalin 24.5.1 WHQL

Today, Lenovo launched the Lenovo ThinkPad P14s Gen 5 designed for professionals who need top-notch performance in a portable 14-inch chassis. Featuring a stunning 16:10 display, this mobile workstation is powered by AMD Ryzen PRO 8040 HS-Series processors. These processors are ultra-advanced and energy-efficient, making them perfect for use in thin and light mobile workstations. The AMD Ryzen PRO HS- Series processors also come with built-in Artificial Intelligence (AI) capabilities, including an integrated Neural Processing Unit (NPU) for optimized performance in AI workflows.

The Lenovo ThinkPad P14s Gen 5 is provided with independent software vendor (ISV) certifications and integrated AMD Radeon graphics, making it ideal for running applications like AutoCAD, Revit, and SOLIDWORKS with seamless performance. This mobile workstation is ideal for mobile power users, offering advanced ThinkShield security features and passes comprehensive MIL-SPEC testing for ultimate durability.

According to ServeTheHome, Intel has decided to discontinue its high-performance computing (HPC) product line, Ponte Vecchio, and shift its focus towards developing its next-generation data center GPU, codenamed Falcon Shores. This decision comes as Intel aims to streamline its operations and concentrate its resources on the most promising and competitive offerings. The Ponte Vecchio GPU, released in January of 2023, was intended to be Intel's flagship product for the HPC market, competing against the likes of NVIDIA's H100 and AMD's Instinct MI series. However, despite its impressive specifications and features, Ponte Vecchio faced significant delays and challenges in its development and production cycle. Intel's decision to abandon Ponte Vecchio is pragmatic, recognizing the intense competition and rapidly evolving landscape of the data center GPU market.

By pivoting its attention to Falcon Shores, Intel aims to deliver a more competitive and cutting-edge solution that can effectively challenge the dominance of its rivals. Falcon Shores, slated for release in 2025, is expected to leverage Intel's latest process node and architectural innovations. Currently, Intel has Gaudi 2 and Gaudi 3 accelerators for AI. However, the HPC segment is left without a clear leader in the company's product offerings. Intel's Ponte Vecchio is powering Aurora exascale supercomputer, which is the latest submission to the TOP500 supercomputer lists. This is also coming after the Rialto Bridge cancellation, which was supposed to be an HPC-focused card. In the future, the company will focus only on the Falcon Shores accelerator, which will unify HPC and AI needs for high-precision FP64 and lower-precision FP16/INT8.

AMD formally launched the Ryzen 7 8700F and Ryzen 5 8400F Socket AM5 desktop processors. These are variants based on the Ryzen 8000-series desktop APUs, but with their integrated graphics disabled. The 8700F may lack integrated graphics, but includes the Ryzen AI NPU, with up to 16 AI TOPS performance. The 8400F lacks an NPU. Much like the 8700G, the 8700F packs an 8-core/16-thread CPU based on the current "Zen 4" architecture, but with a 100 MHz lower maximum boost frequency of 5.00 GHz. The TDP is the same, at 65 W, and the retail package includes a Wraith Stealth cooler.

The Ryzen 5 8400F is a 6-core/12-thread processor, but much like the 8500G, it is based on the "Phoenix 2" silicon, which has two "Zen 4" cores that can achieve the maximum 4.70 GHz boost frequency for this chip, and four "Zen 4c" that boost lower. Both kinds of cores feature an identical IPC and ISA, and so AMD Chipset Software uses UEFI CPPC preferred cores software flags to prioritize workload to the "Zen 4" cores. AMD in its launch presentation claims that the 8700F should offer competitive gaming and productivity performance to an Intel Core i5-14400F, and that the 8400F should offer gaming performance in the league of an i5-13400F. The company is pricing the 8700F at $269, or $60 cheaper than the 8700G; while the 8400F is priced at $169, or $10 less than the 8500G.