It has been reported by multiple users across several online communities that their Wii U consoles are no longer functioning properly. The error codes 160-0103 and 160-2155 are the dreaded indicators of memory corruption. It has been discovered that the NAND Flash within the Wii U's internal eMMC is prone to failure. According to details gleaned from teardowns of the console's hardware, Nintendo has implemented either Toshiba or Samsung flash storage boards for the various revisions of the console. There has been an uptick in the rate of bricked Wii U consoles across recent months, but the problems seem to have occurred as far back as 2015, according to archived posts on the GBA Temp forum. It is speculated that leaving the Wii U inactive for long periods of time can lead to the memory corruption issues.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is announcing an extreme performance DDR5 memory kit based on the latest 24 GB module capacity, with a specification of DDR5-8000 CL38-48-48 at 48 GB (24 GB x2) under the flagship Trident Z5 RGB series, and setting a new bar for extreme overclocked memory with 24 GB capacity modules.

With Samsung Electronics announcing that the next-generation GDDR7 memory standard is in development, and Cadence, a vital IP provider for DRAM PHY, EDA software, and validation tools announcing its latest validation solution, the decks are clear for the new memory standard to debut with the next-generation of GPUs. GDDR7 would succeed GDDR6, which had debuted in 2018, and has been around for nearly 5 years now. GDDR6 launched with speeds of 14 Gbps, and its derivatives are now in production with speeds as high as 24 Gbps. It provided a generational doubling in speeds from the preceding GDDR5.

The new GDDR7 promises the same, with its starting speeds said to be as high as 36 Gbps, going beyond the 50 Gbps mark in its lifecycle. A MyDrivers report says that NVIDIA's next-generation GeForce RTX 50-series, probably slated for a late-2024 debut, as well as AMD's competing RDNA4 graphics architecture, could introduce GDDR7 at its starting speeds of 36 Gbps. A GPU with a 256-bit wide GDDR7 interface would enjoy 1.15 TB/s of bandwidth, and one with 384-bit would have a cool 1.7 TB/s to play with. We still don't know what is the codename of NVIDIA's next graphics architecture, it could be any of the ones NVIDIA hasn't used from the image below.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced new high-speed 7000MT/s 48 GB (2x 24 GB) VENGEANCE RGB DDR5 and VENGEANCE DDR5 memory kits, as well as the general availability of its massive 192 GB (4x 48 GB) DDR5-5200 kits. CORSAIR has worked closely with motherboard manufacturer ASUS to ensure that these new kits work flawlessly across its full range of 700 series motherboards, making them an ideal high-speed companion for the latest 13th Gen Intel Core processors.

These new memory kits are compatible with all Intel 700 series motherboards, but the close working relationship between ASUS and CORSAIR demonstrates both company's commitment to delivering optimal performance and compatibility for customers. Rigorous testing of these new VENGEANCE DDR5 memory kits ensures they work across the full range of ASUS motherboards, including at the new higher DDR5-7000 speeds.

Netac on Wednesday launched the Hurricane Z RGB line of premium DDR5 memory kits. These are characterized by their chunky aluminium heatspreaders that have a clear chrome finish (claimed to be silver-plated), and crowned by silicone addressable-RGB LED diffusers. The company released dual-channel (two module) kits with densities of 32 GB (2x 16 GB), across six speed-based variants.

At the very top is a DDR5-8000 variant with 38-48-48-128 timings and 1.5 V module voltage; followed by a DDR5-7600 variant that offers 36-46-46-122 timings at 1.4 V. A notch below is the DDR5-7200 variant with 34-45-45-115 timings and 1.4 V; followed by a DDR5-6600 variant with slightly tighter 34-40-40-105 timings at the same 1.4 V. The DDR5-6200 variant offers a tighter 32-38-38-96 timings at 1.35 V, while the series begins with a DDR5-6000 variant with 36-36-36-96 timings at 1.35 V. All six variants rely on XMP 3.0 profiles to enable their advertised speeds and timings. Under the hood, these modules are using SK hynix-sourced DRAM chips. Netac released the Hurricane Z RGB series in China first, where its prices range between the equivalent of $203 and $335, depending on the model.

Lexar, a leading global brand of flash memory solutions, is excited to announce Lexar ARES RGB DDR5 Desktop Memory. Specifically designed for gaming, this next-gen DDR5 memory delivers superior performance with speeds starting at DDR5-5600 and up to DDR5-6000, and with quick CL32-36-36-68 / CL34-38-38-76 timings (XMP 3.0 & EXPO). A premium aluminium heatspreader keeps the gaming system cool for ultra-fast performance.

Lexar ARES RGB DDR5 Desktop Memory features on-board Power Management IC (PMIC) to provide better power control and power delivery and it also includes Lexar RGB Sync which lets gamers customize the RGB LED to their own style. "Lexar ARES RGB DDR5 Desktop Memory provides the performance that gamers need to master the latest games—and the upcoming titles that will require the speed and capacity of DDR5," said Joey Lopez, Director Brand Marketing. "And in addition to the performance, this memory also features Lexar RGB Sync so gamers can play in style."

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce the return of the 7th Annual OC World Cup 2023, after a 3-year hiatus. The G.SKILL OC World Cup extreme overclocking competition will begin with the Online Qualifier stage, held from March 1, 2023 until April 5, 2023 on hwbot.org. Then the top 9 overclockers of the online qualifier will become finalists, who are qualified to join the live competition at the G.SKILL booth during Computex 2023 week from May 30, 2023 to June 2, 2023 and compete for a portion of the $40,000 USD total cash prize pool, with the OC Champion title taking home $10,000 USD!

With the participation of top extreme overclockers from around the world and carefully crafted rules designed to test the ability of each overclocker, the G.SKILL OC World Cup is considered to be one of the most challenging overclocking competition by professional overclockers. The G.SKILL OC World Cup consists of three rounds: Online Qualifier, Live Qualifier, and Grand Final. The top 9 overclockers of the Online Qualifier will be eligible to enter the Live Qualifier stage during the week of Computex 2023 at the G.SKILL booth, and the top 3 overclockers from the Live Qualifier stage will compete for the title of OC Champion in the Grand Final.

ASRock is announcing the support of 48 GB and 24 GB DDR5 memory module across Intel 700 and 600 Series motherboards, boosting the maximum memory capacity from 128 GB to 192 GB on 4 DIMMs, providing performance and compatibility to enthusiasts.

For maximum performance, BIOS update is recommended to achieve a boost of system performance as well as memory capacity, increasing productivity for memory demanding multitasking applications.

According to SkatterBench, a website known for incredible overclocking attempts, we get to see AMD's Ryzen 7000 series integrated GPU get up to 42% performance improvement from overclocking. Specifically, the SKU used in the attempt was the Ryzen 9 7900 non-X model with 12 cores and 24 threads, clocked at 3.7 GHz base frequency and 5.4 GHz boost speed. The SKU contains a basic AMD GPU integrated into the package; however, not meant for any serious gaming tasks. Nonetheless, it is interesting to see what a two-core RDNA2 GPU clocked at 2.2 GHz managed to achieve once overclocked. The memory clock of the GPU is set to 2.4 GHz at stock.

Running at the base voltage of 0.997 volts under Furmark workload, the iGPU consumes around 38.5 Watts. However, the overclocking attempt pushed the voltage to 1.395 Volts, resulting in a 3.1 GHz iGPU frequency. The GPU Memory clock is now set to 3200 MHz, and the GPU+SOC power is 60.689 Watts, almost double compared to the stock settings. The overclocker used a GFX curve optimizer with various system tweaks to achieve these numbers. While the OC attempt was successful, the most significant performance improvement was a 42% increase, with some game titles averaging less. Below, the blue bar indicates stock, while the green bar indicates OC'd performance. You can check out the YouTube video as well to see more details.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced massive new capacities for its DDR5 memory kits, thanks to new 24 GB and 48 GB UDIMM modules. For the first time from CORSAIR, PC builders can choose from 192 GB (4x 48 GB), 96 GB (2x 48 GB), or 48 GB (2x 24 GB) memory kits. Available in either VENGEANCE RGB DDR5 or VENGEANCE DDR5 kits, these new high capacities are ideal for the most demanding, high-capacity applications such as 8K video editing, as well as DRAM-heavy AI and deep learning workloads. Motherboards with just two memory slots, including Micro ATX and Mini-ITX builds, where space is tight but large capacities are needed also benefit.

CORSAIR VENGEANCE RGB DDR5 and VENGEANCE DDR5, already top choices for performance enthusiasts, are optimized for the latest gaming PCs and workstations and at these new capacities give custom PC enthusiasts the option to build with memory configurations that weren't possible until now. Both 96 GB and 48 GB kits are available immediately in both RGB and non-RGB flavors, running at 5,600MT/s and 5,200MT/s and support Intel XMP 3.0 memory overclocking to ensure owners can easily run their memory at the intended speeds.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today announced that its Intel 700 and 600 series DDR5 motherboards can support 24 GB and 48 GB memory modules without BIOS update. This boosts the maximum RAM support from 128 GB to 192 GB on four DIMMs, and 64 GB to 96 GB on two DIMMs. The maximum speed runs up to XMP 7000 on 2 DIMMs 24 GB configuration.

Users can enjoy an effortless overall boost of memory capacity and system performance on both Intel XMP and AMD EXPO platforms, as well as a productivity uplift for multitasking gamers and RAM demanding users. Get your GIGABYTE motherboards now and enjoy the boost. To avail this, update to the latest BIOS on your compatible motherboard.

Today MSI is announcing the support of 48 GB and 24 GB DDR5, non-binary memory across Intel 700 and 600 Series motherboards, including MEG, MPG, MAG, and PRO Series products. Namely, the maximum memory capacity support is increased to 192 GB for 4 DIMMs motherboards and 96 GB for 2 DIMMs motherboards. MSI has committed to providing performance and compatibility to DIY enthusiasts.

It is unnecessary to update motherboard BIOS for supporting 48 GB based memory modules. Just install the new memory module to enjoy a more efficient system with more productivity, especially for those multi-tasking gamers and users.

Neo Forza today unveiled the Trinity DDR5-7200 32 GB (2x 16 GB) dual-channel memory kit. Based on SK hynix A-dies, the modules pack an Intel XMP 3.0 profile that runs the kit at its advertised speed of DDR5-7200. It also includes an AMD EXPO profile, although this enables a slightly lower speed of DDR5-6400. The DDR5-7200 XMP 3.0 profile ticks at timings of 36-46-46-82; while the DDR5-6400 EXPO profile offers 40-40-40-77. Both these profiles run the modules at 1.4 V. Neo Forza claims that the module comes with good overclocking headroom, and they've achieved DDR5-8000 on an Intel Core i9-13900K machine with minimal effort. The company didn't reveal pricing or availability information.

Samsung Electronics today reported financial results for the fourth quarter and the fiscal year 2022. The Company posted KRW 70.46 trillion in consolidated revenue and KRW 4.31 trillion in operating profit in the quarter ended December 31, 2022. For the full year, it reported 302.23 trillion in annual revenue, a record high and KRW 43.38 trillion in operating profit.

The business environment deteriorated significantly in the fourth quarter due to weak demand amid a global economic slowdown. Earnings at the Memory Business decreased sharply as prices fell and customers continued to adjust inventory. The System LSI Business also saw a decline in earnings as sales of key products were weighed down by inventory adjustments in the industry. The Foundry Business posted a new record for quarterly revenue while profit increased year-on-year on the back of advanced node capacity expansion as well as customer base and application area diversification.

Today, the Open Compute Project Foundation (OCP), the nonprofit organization bringing hyperscale innovations to all, and JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, announce a new collaboration to establish a framework for the transfer of technology captured in an OCP-approved specification to JEDEC for inclusion in one of its standards. This alliance brings together members from both the OCP and JEDEC communities to share efforts in developing and maintaining global standards needed to advance the electronics industry.

Under this new alliance, the current effort will be to provide a mechanism to standardize Chiplet part descriptions leveraging OCP Chiplet Data Extensible Markup Language (CDXML) specification to become part of JEDEC JEP30: Part Model Guidelines for use with today's EDA tools. With this updated JEDEC standard, expected to be published in 2023, Chiplet builders will be able to provide electronically a standardized Chiplet part description to their customers paving the way for automating System in Package (SiP) design and build using Chiplets. The description will include information needed by SiP builders such as Chiplet thermal properties, physical and mechanical requirements, behavior specifications, power and signal integrity properties, testing the Chiplet in package, and security parameters.

With the once-lucrative business of cryptocurrency mining now slowly falling out of favor for discrete graphics, crypto miners are turning their heads to creative solutions to "refurbish" and sell their remaining inventory to third-party users. When GPU components, such as the die or GDDR memory, overheat, they can produce visual signs of damage, such as discoloration or melting. Some miners have started painting the memory on their GPU's boards with special thermal paint to hide the wear and tear from the naked eye and make the GDDR chips appear new in hopes that no one would notice. According to Iskandar Souza and TecLab, their cases are now getting debunked.

As these reports note, miners are removing the stock cooling systems from GPUs to install a third-party solution or recently tried to resolder failed GPU dies back in place and paint the yellowish GDDR memory chips. According to the testing done by Iskandar Souza, you can see below the difference between a worn-out yellowish GDDR chip and its painted deception standing next to one another. Below you can also see the process of resoldering failed GPUs back in place. Crypto miners have been very careful to make them look almost as brand new, so GPU buyers from third-party sources need to be extra cautious before making a purchase.

Laptop memory has been a controversial topic for many years. Its proprietary standard, SO-DIMM, has shown signs of aging as the decades-old JEDEC standard didn't adapt to other expanding capacities and speed trends. Today, JEDEC and Dell think that the future of laptop memory is in the new CAMM standard that both companies are working on. The introduction of CAMM comes from Dell, whose Senior Distinguished Engineer Tom Schnell is working on it. "We have unanimous approval of the 0.5 spec," said Mr. Schnell for PCWorld. One of the problems that SO-DIMM is facing is the capacity and speed issue, where the current DDR5 SO-DIMM memory stops at around 6400 MT/s. CAMM, on the other hand, starts from that speed and works its way up to offer higher capacities as well.

With Dell introducing CAMM in its laptops, it had no intentions of creating a proprietary solution but rather an expandable and upgradable memory platform with various benefits. With JEDEC's involvement in finalizing this, the CAMM standard is slowly on its way to becoming a viable option for different laptop manufacturers. Dell's Tom Schnell didn't reveal what companies are in the process of creating the final specification; however, we know that 32 of them are present, including Apple. If others join, the standard could take over future laptop designs and offer higher speeds and higher capacities, especially in the mobile workstation space where it matters. Below is an example of a CAMM memory module with a patent showing the SO-DIMM (upper left) versus CAMM (lower right) and CAMM's smaller trace path. With smaller tracing, the latency is also going down, so the new standard will bring additional efficiency. Additionally, devices that are based on LPDDR memory could have an upgrade path with the installment of CAMM.

SK hynix Inc. (or "the company", www.skhynix.com) announced today that its DDR5 product for servers using 1anm, the fourth generation of the 10 nm process technology, has been validated on the 4th Gen Intel Xeon Scalable processor (formerly codenamed Sapphire Rapids) for the first time in the industry. "The validation of the 1anm DDR5 compatibility by Intel for its newest processor that supports DDR5 for the first time is monumental," SK hynix said. "We will seek a fast turnaround in the semiconductor memory industry by actively responding to the growing server market through DDR5, which is already in mass production."

The validation of the company's 1anm DDR5 product, which adopts 1anm technology using the EUV lithography process, is for 4th Gen Intel Xeon Scalable processors, Intel's latest server CPU launched on January 10th. The 4th Gen Intel Xeon Scalable processor has been cited as a key to a turnaround in the industry, given that the launch of a next-generation server CPU requires server replacement and thus, results in a rapid increase in demand for high-performance memory chips. Experts predict that DDR5, expected to meet customers' such needs, will soon become the flagship product in the server DRAM market.

Taiwan-based memory products OEM Datotek has been in business selling flash memory and DRAM products since 2004, with one of its most notable clients being HP. At the 2023 International CES, the company showcased its latest-generation memory products spanning not just HP-branded flash drives, but also flash drives under its own marquee, besides M.2 NVMe and 2.5-inch SATA SSDs; and PC memory spanning DDR5 and DDR4 generations. The company sells various vanilla (JEDEC spec) DDR5 and DDR4 memory modules in both standard U-DIMM and SO-DIMM form-factors. For gamers and enthusiasts, the company has the Ares line of premium DDR5 and DDR4 memory products, which come in overclocked speeds such as DDR5-6000 or DDR4-4000, including with RGB LED illumination.

Among its SSD products are a new PCIe Gen 5 NVMe SSD under the Ares brand, Gen 4 NVMe drives under the Ares Dark Sword brand, and various Gen 3 NVMe SSDs under the main Datotek brand. We also spotted several USB 3.2 portable SSDs, as well as 2.5-inch SATA 6 Gbps ones under the main brand. The idea here is to attract more brands for OEM partnerships the way rival Biwin makes SSD and DRAM products for various top brands (such as HP and Acer).

Micron Technology, Inc., today announced that its DDR5 server memory portfolio for the data center is now fully validated on the 4th Gen Intel Xeon Scalable processor family. Micron DDR5 memory delivers up to twice the memory bandwidth over previous generations, which is essential to fueling the rapid growth of cores in today's data center processors. Transitioning to DDR5 will help alleviate a potential bottleneck for years to come by providing higher bandwidth to unlock more computer power per processor. Micron DDR5, in combination with 4th Gen Intel Xeon Scalable processors, benefits a wide range of workloads including SPECjbb, which delivers up to 49% performance improvement on benchmarking for Critical-jOPS (Java operations per second) compared to previous generations. In addition to increased memory bandwidth and performance, Micron DDR5 memory is also designed to improve reliability across the data center with features such as on-die Error Correction Code (ODECC) and bounded faults. On-die ECC corrects single-bit errors and detects multi-bit errors.

"The deep collaboration we have established with Intel as a highly valued ecosystem partner, has allowed Micron to remain at the forefront of the industry transition to DDR5," said Raj Hazra, senior vice president and general manager of Micron's Compute and Networking Business Unit. "This work has been pivotal in developing solutions that meet the complex needs and challenges of our data center customers as they convert massive amounts of data into insights."

Giga Computing is an industry leader in high-performance servers and workstations, today announced the next-generation of GIGABYTE servers and server motherboards for the new 4th Gen Intel Xeon Scalable processor to achieve efficient performance gains with built-in accelerators. The new processors have the most built-in accelerators of any processor on the market to help maximize performance efficiency for emerging workloads; and do so while boosting virtualization and AI performance. Generational improvements make this platform ideal for AI, cloud computing, advanced analytics, HPC, networking, and storage applications. For these markets, Giga Computing has announced fourteen new series that constitute seventy-eight configurations for customers to choose from. And all these new GIGABYTE products support the full portfolio of 4th Gen Intel Xeon Scalable processors, including those with high bandwidth memory (HBM) in the Intel Xeon Max Series.

Patriot Memory is, well, a PC memory company first, and it acts like one, by bring to CES its fastest DDR5 memory offerings. The new Patriot Viper Venom RGB/non-RGB is the company's new high-end enthusiast memory product, and comes with speeds ranging between DDR5-5200 to DDR5-7400, and capacities up to 64 GB. The Viper Xtreme 5 rules the pack with capacity ranging up to 32 GB, but speeds between DDR5-7600 and the top DDR5-8000. The Viper Elite 5 is a notch below the two, and comes in speed ranges between DDR5-5600 to DDR5-6000. Intel XMP 3.0 profiles enable the advertised speeds and the click of a button.

The Signature and Signature Premium lines of DDR5 memory come in speeds of up to DDR5-5600, and cover the company's mainstream lineup. The Signature Premium includes a heatspreader, the Signature doesn't. It's good to see Patriot continue to ship DDR4 kits to the crowd that's transitioning between the two memory standards. The new Viper 4 Blackout series features a retro-Patriot style that's reminiscent of the company's DDR2 days, comes in densities of up to 64 GB, and speeds of up to DDR4-4400.

Thermaltake's CES booth was lit up with a vibrant mix of illuminated enthusiast PC memory modules, from its ToughRAM D5 RGB series. The company is going beyond boring black and white heatspreader color options, and now has die-cast aluminium heatspreader in a number of colors, including gold, red, and turquoise. Even the usual black and white ones come with new printed patterns, under the ToughRAM D5 RGB XG series. The ToughRAM D5 RGB XG comes in speeds of up to DDR5-6600, and per-module capacity of up to 32 GB along with 16-diode RGB LED setup; whereas the regular ToughRAM D5 RGB ticks at speeds of up to DDR5-5600, up to 32 GB density, and a 6-diode LED setup diffused through a silicone band.

Last year it felt like DDR5-6000 to DDR5-6400 was the top of the PC memory food-chain, and in a year, this has been pushed up to DDR5-8000. Platforms such as the 13th Gen Core "Raptor Lake" can already handle such high memory speeds, and ADATA has designed such a memory module that includes an Intel XMP 3.0 profile that enables the advertised DDR5-8000 speed at the click of a button. The new ADATA XPG Caster RGB DDR5-8000 features a chunky aluminium heatspreader that's crowned by a silicone addressable RGB LED diffuser. It's been tested for compatibility with both Intel and AMD platforms, however only an XMP 3.0 profile is included.

Elsewhere across the ADATA booth, we also came across the company's latest SD 8.0 memory card that uses PCI-Express 3.0 x2 physical layer and NVMe 1.3 protocol layer, to offer sequential speeds of up to 1600 MB/s reads, with up to 1300 MB/s writes, including LDPC ECC. The card comes in 256 GB and 512 GB capacities, and is backwards-compatible with UHS-I devices. Back at the memory section, we found an XPG + ASUS ROG co-branded Lancer ROG DDR5 memory that comes at speeds of up to DDR5-6600. Lastly, there's the ACE-6400, a mid-range DDR5-6400 memory module targeting creators, that runs at DDR5-5600 native (JEDEC), and its advertised DDR5-6400 using an XMP 3.0 profile.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions today unveiled the latest Intel B760 series motherboards. With enhanced XMP and hardware design of memory, the full B760 DDR5 lineup can achieve superb Z790-like memory performance of DDR5-7600. Featuring up to 16+1+1 phases of 60 amps digital power VRM design with full-coverage heatsink, GIGABYTE's B760 lineup provides premium power and thermal design for the high-frequency operation of Intel 13th gen processors. Meanwhile, the innovative PCIe and M.2 EZ-Latch technology are implemented to simplify the upgrade of graphics cards and M.2 SSDs, and to avoid accidental damage to the surrounding components. Moreover, the features of 2.5 GbE LAN, Wi-Fi 6E, USB 3.2 Gen 2x2 Type C with 20 Gbps, and up to 3 sets of PCIe 4.0 x4 M.2 slots with armor on select models offer superb connectivity. Further with the latest GIGABYTE PerfDrive technology and GCC software platform, GIGABYTE delivers the outstanding B760 platform with the optimal hardware, software, and firmware which covers from DDR4 to DDR5 with full form factor options of ATX, Micro ATX, and Mini ITX.

In the Intel product plan, the "Z" chipset is the only platform to support CPU and memory overclocking. However, the B chipset with limited DDR frequency tuning offers more budget friendly options, especially those only require memory overclocking. In order to provide solid power for high-performance operation of CPU and XMP overclocking, GIGABYTE B760 AORUS motherboards are geared up to 16+1+1 power phases with 60 amps DrMOS design, while the well-received B760 AORUS ELITE features 12+1+1 power phases, and the leading power design of 14+1+1 phases on B760M AORUS PRO. These power designs allow GIGABYTE B760 AORUS motherboards of all configuration to deliver the most stable power, as well as to provide sufficient power when the CPU runs full loading. Meanwhile, enhanced by full-coverage heatsink, 5 W/mK thermal pad, and 2x copper PCB, B760 AORUS MASTER/ PRO/ ELITE/ GAMING X lineup covers from ATX to micro ATX models boast superb thermal design to improve the stability and keep the power supply area which is most likely to generate heat staying cool.