AMD's next-generation Ryzen 9000 "Strix Point" mobile processor, which succeeds the current Ryzen 8040 "Hawk Point" and Ryzen 7040 "Phoenix," is confirmed to feature a CPU core-configuration of 12-core/24-thread, according to a specs-leak by HKEPC citing sources among notebook OEMs. It appears like Computex 2024 will be big for AMD, with the company preparing next-gen processor announcements across the desktop and notebook lines. Both the "Strix Point" mobile processor and "Granite Ridge" desktop processor debut the company's next "Zen 5" microarchitecture.

Perhaps the biggest takeaway from "Zen 5" is that AMD has increased the number of CPU cores per CCX from 8 in "Zen 3" and "Zen 4," to 12 in "Zen 5." While this doesn't affect the core-counts of its CCD chiplets (which are still expected to be 8-core), the "Strix Point" processor appears to use one giant CCX with 12 cores. Each of the "Zen 5" cores has a 1 MB dedicated L2 cache, while the 12 cores share a 24 MB L3 cache. The 12-core/24-thread CPU, besides the generational IPC gains introduced by "Zen 5," marks a 50% increase in CPU muscle over "Hawk Point." It's not just the CPU complex, even the iGPU sees a hardware update.

Enthusiasts on the ChipHell forum scored an alleged image of AMD's upcoming "Strix Halo" mobile processor, and set out to create some highly plausible schematic slides. These are speculative. While "Strix Point" is the mobile processor that succeeds the current "Hawk Point" and "Phoenix" processors; "Strix Halo" is in a category of its own—to offer gaming experiences comparable to discrete GPUs in the ultraportable form-factor where powerful discrete GPUs are generally not possible. "Strix Halo" also goes head on against Apple's M3 Max and M3 Pro processors powering the latest crop of MacBook Pros. It has the same advantages as a single-chip solution, as the M3 Max.

The "Strix Halo" silicon is a chiplet-based processor, although very different from "Fire Range". The "Fire Range" processor is essentially a BGA version of the desktop "Granite Ridge" processor—it's the same combination of one or two "Zen 5" CCDs that talk to a client I/O die, and is meant for performance-thru-enthusiast segment notebooks. "Strix Halo," on the other hand, use the same one or two "Zen 5" CCDs, but with a large SoC die featuring an oversized iGPU, and 256-bit LPDDR5X memory controllers not found on the cIOD. This is key to what AMD is trying to achieve—CPU and graphics performance in the league of the M3 Pro and M3 Max at comparable PCB and power footprints.

The RDNA 3+ graphics architecture will power integrated graphics solutions of AMD processors for the foreseeable future, a reliable source with AMD leaks says. The company is planning to debut RDNA 3+, a feature update to RDNA 3, with the upcoming Ryzen "Strix Point" mobile processor. A scaled-up version will power the "Strix Halo" processor meant for notebooks with powerful integrated graphics. Given that AMD is able to scale between a certain number of compute units for its "Strix Point" and "Strix Halo" processors, it could stick with the graphics architecture for iGPUs with its upcoming processor microarchitectures even 3 years into the future.

This isn't new for AMD, the company's Vega graphics architecture debuted in 2017, but powered the iGPUs of its "Cezanne" mobile processor that came out as recently as 2021. The RDNA 3-based iGPU powering the current "Hawk Point" processor trades blows with the Arc "Alchemist" Xe-LPG iGPU powering Intel's "Meteor Lake" processor. Intel is expected to make a generational jump in iGPU performance with its upcoming "Lunar Lake" processor that debuts the Xe2 "Battlemage" graphics architecture for its iGPU, to which AMD is responding with a new iGPU based on the updated RDNA 3+.